Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding
نویسندگان
چکیده
Almost all direct wafer bonding has been conducted between chemical-mechanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical polishing in the wafer bonding will make a large range of materials suitable for direct wafer bonding, which has found and will find more, applications in integrated circuits, integrated optics, sensors and actuators, and microelectromechanical systems.
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تاریخ انتشار 2004